Effect of Substrate Composition on Sn Whisker Growth in Pure Sn FilmsMILLER, Sarah M; SAHAYM, Uttara; NORTON, M. Grant et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2010, Vol 41, Num 13, pp 3386-3395, issn 1073-5623, 10 p.Article

Effect of Sn on the Dehydrogenation Process of TiH₂ in Al FoamsAGUIRRE-PERALES, Lydia Y; JUNG, In-Ho; DREW, Robin A. L et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2012, Vol 43, Num 1, pp 1-5, issn 1073-5623, 5 p.Article

Effect of Sn addition on the corrosion behavior of Ti-Ta alloyGUO, B; TONG, Y. X; CHEN, F et al.Materials and corrosion (1995). 2012, Vol 63, Num 3, pp 259-263, issn 0947-5117, 5 p.Article

Effect of Sn Additions on the Damage Tolerance of a ZrCuNiAl Bulk Metallic GlassYUAN, C. C; XIA, X. X; JIANG, K. H et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2013, Vol 44, Num 2, pp 819-826, issn 1073-5623, 8 p.Article

Effects of Cu, Sn and W on the rate of nitrogen dissociation on the surface of molten ironONO-NAKAZATO, Hideki; DOHI, Yusuke; YAMADA, Daisuke et al.ISIJ international. 2006, Vol 46, Num 9, pp 1306-1311, issn 0915-1559, 6 p.Article

Effects of Sn segregation and precipitates on creep response of Mg-Sn alloysHUANG, Y; DIERINGA, H; KAINER, K. U et al.Fatigue & fracture of engineering materials & structures (Print). 2013, Vol 36, Num 4, pp 308-315, issn 8756-758X, 8 p.Article

Effect of Sn Grain Orientation on the Cu₆Sn₅ Formation in a Sn-Based Solder Under Current StressingLIN, Chih-Fan; LEE, Shang-Hua; CHEN, Chih-Ming et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2012, Vol 43, Num 8, pp 2571-2573, issn 1073-5623, 3 p.Article

TEM and ESCA observations of copper deposits containing tin impuritiesYOKOTA, T; KANEKO, H; HANZAWA, N et al.Hyomen gijutsu. 1998, Vol 49, Num 5, pp 519-524, issn 0915-1869Article

Effects of rotational stirring on Zn-0.05% Sn alloy castingsHOSHINO, K; NAGADOME, Y; SAKAI, T et al.Imono. 1996, Vol 68, Num 2, pp 124-129, issn 0021-4396Article

Sintering of lead bronze containing tinKUMAR, S; UPADHYAYA, G. S; VAIDYA, M. L et al.Journal of materials engineering. 1991, Vol 13, Num 3, pp 237-242, issn 0931-7058Article

Influence of Tin Addition on the Microstructure and Mechanical Properties of Al-Si-Cu-Mg and Al-Si-Mg Casting AlloysMOHAMED, A. M. A; SAMUEL, F. H; SAMUEL, A. M et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2008, Vol 39, Num 3, pp 490-501, issn 1073-5623, 12 p.Article

Effect of Sn Addition in Preprecipitation Stage in Al-Cu Alloys: A Correlative Transmission Electron Microscopy and Atom Probe Tomography StudyHOMMA, Tomoyuki; MOODY, Michael P; SAXEY, David W et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2012, Vol 43, Num 7, pp 2192-2202, issn 1073-5623, 11 p.Article

A complementary electrochromic system based on a Prussian blue thin film and a heptyl viologen solutionLIN, Chiao-Fen; HSU, Chih-Yu; LO, Hwa-Chiang et al.Solar energy materials and solar cells. 2011, Vol 95, Num 11, pp 3074-3080, issn 0927-0248, 7 p.Article

Effects of ITO precursor thickness on transparent conductive Al doped ZnO film for solar cell applicationsKANG, Dong-Won; KUK, Seung-Hee; JI, Kwang-Sun et al.Solar energy materials and solar cells. 2011, Vol 95, Num 1, pp 138-141, issn 0927-0248, 4 p.Conference Paper

RF-sputtered Ge-ITO nanocomposite thin films for photovoltaic applicationsSHIH, G. H; ALLEN, C. G; POTTER, B. G et al.Solar energy materials and solar cells. 2010, Vol 94, Num 5, pp 797-802, issn 0927-0248, 6 p.Article

Low-pressure H₂/N₂ annealing on indium tin oxide filmCHANG, Shang-Chou.Microelectronics journal. 2007, Vol 38, Num 12, pp 1220-1225, issn 0959-8324, 6 p.Article

The effect of Sn addition on the glass-forming ability of Cu-Ti-Zr-Ni-Si metallic glass alloysPARK, E. S; LIM, H. K; KIM, W. T et al.Journal of non-crystalline solids. 2002, Vol 298, Num 1, pp 15-22, issn 0022-3093Article

Influence of thermal history on surface hot-shortness of Cu-Sn bearing steelHATANO, Masaharu; KUNISHIGE, Kazutoshi; KOMIZO, Yuichi et al.Tetsu-to-hagané. 2002, Vol 88, Num 3, pp 142-147, issn 0021-1575Article

Atom probe analysis of Sn in Zr-based alloysSANO, N; TAKEDA, K.Journal of nuclear materials. 1998, Vol 252, Num 1-2, pp 63-70, issn 0022-3115Article

Gas sensitivity of Zn doped α-Fe₂O₃(SO₄^2-, Sn, Zn) to carbon monoxideHE, F. J; YAO, T; QU, B. D et al.Sensors and actuators. B, Chemical. 1997, Vol 40, Num 2-3, pp 183-186, issn 0925-4005Article

Caractéristiques d'usure par glissement alternatif de composites cuivre-fibres de carboneKUNIYA, K; ARAKAWA, H; NAMEKAWA, T et al.Nippon Kinzoku Gakkaishi (1952). 1986, Vol 50, Num 1, pp 119-125, issn 0021-4876Article

Optimal design of electrode grids dimensions for ITO-free organic photovoltaic devicesCHEKNANE, Ali.Progress in photovoltaics (Print). 2011, Vol 19, Num 2, pp 155-159, issn 1062-7995, 5 p.Article

Spectral control of emissions from tin doped targets for extreme ultraviolet lithographyHARILAL, S. S; O'SHAY, B; TILLACK, M. S et al.Journal of physics. D, Applied physics (Print). 2006, Vol 39, Num 3, pp 484-487, issn 0022-3727, 4 p.Article

An X-ray photoelectron spectroscopy study of the interface formed between ITO and 4,4'-bis(4-dimethyl amino styryl)benzene based light emitting diodeIP, J; NGUYEN, T. P; LE RENDU, P et al.Synthetic metals. 2003, Vol 138, Num 1-2, pp 107-111, issn 0379-6779, 5 p.Conference Paper

Surface treatment effects of indium-tin oxide in organic light-emitting diodesJUNG, S; PARK, N. G; KWAK, M. Y et al.Optical materials (Amsterdam). 2003, Vol 21, Num 1-3, pp 235-241, issn 0925-3467, 7 p.Conference Paper